Suchen und Finden
Service
Flash Lamp Annealing - From Basics to Applications
Lars Rebohle, Slawomir Prucnal, Denise Reichel
Verlag Springer-Verlag, 2019
ISBN 9783030232993 , 304 Seiten
Format PDF, OL
Kopierschutz Wasserzeichen
Geräte
Preface
6
Acknowledgements
7
References
8
Contents
9
Acronyms
12
Symbols
14
1 Introduction
18
1.1 Historical Remarks
19
1.2 The Thermal Cycle
24
1.3 Short Time Annealing
26
References
28
2 The Technology of Flash Lamp Annealing
32
2.1 Basic Structure of an FLA Tool
32
2.2 Components of a Flash Lamp
36
2.2.1 Dimensions and Gas Filling
37
2.2.2 Electrodes
38
2.2.3 The Envelope
40
2.2.4 Cooling
42
2.3 Plasma Discharge
43
2.3.1 Trigger Pulse and Initial Streamer Formation
43
2.3.2 Arc Expansion
46
2.3.3 Plasma Properties in the Wall-Stabilized Regime
48
2.3.4 The Post-discharge Period
54
2.4 Electric Operation
55
2.4.1 Electric Characteristics of a Flash Lamp
55
2.4.2 Circuitries
56
2.4.3 Modelling of a Single RLC Section Circuit
59
2.4.4 Active Pulse Shaping
62
2.5 Optical Output
64
2.5.1 The Plasma Spectrum
64
2.5.2 Transparency and Radiation Pattern
66
2.5.3 Time-Resolved Optical Properties
68
2.5.4 Shaping the Spectral Output
68
2.6 Flash Lamp Lifetime
72
2.6.1 Single and Multiple Flash Operation
72
2.6.2 Lamp Failure
73
2.6.3 Lamp Degradation
77
2.7 Layout of FLA Tools
79
2.7.1 From Sheet-to-Sheet to Roll-to-Roll Processes
79
2.7.2 Flash-Assisted Deposition
81
References
84
3 Process Management
88
3.1 Temperature Measurement
88
3.1.1 Pyrometry
89
3.1.2 Temperature Measurement of Semiconductors
91
3.1.3 Temperature Measurement During Annealing of Non-semiconductors
101
3.1.4 True Temperature Measurement
103
3.2 Temperature Simulations
106
3.2.1 Mathematical Background
106
3.2.2 Chamber Wall Reflection
111
3.2.3 Temperature Profiles
115
3.2.4 Heat Dissipation
121
3.3 Homogeneity
123
3.3.1 The Homogeneity of Irradiation
123
3.3.2 Pattern Effects
128
3.4 Thermal Stress
131
3.4.1 Silicon
131
3.4.2 Glassy Substrates and Thin Films
136
3.5 Further Effects
138
References
142
4 Semiconductor Applications
147
4.1 Defect Engineering
147
4.1.1 Defect Evolution During Annealing
147
4.1.2 Boron Diffusion in Si
149
4.1.3 Studies Related to Flash Lamp Annealing
151
4.2 Doping
152
4.2.1 Ultra-Shallow Junctions in Silicon
152
4.2.2 Hyperdoping in Silicon
160
4.2.3 Doping and Superconductivity in Germanium
167
4.2.4 Doping of Silicon Carbide
179
4.2.5 Doping of III–V Compound Semiconductors
184
4.2.6 Diluted Magnetic Semiconductors
190
4.3 Crystallization
194
4.3.1 Non-equilibrium Crystallization Modes
194
4.3.2 Thin Films of Amorphous Silicon
202
4.3.3 Silicon Compound Semiconductors
206
4.4 Semiconductor Nanostructures
210
4.4.1 Group IV Nanocluster
210
4.4.2 Integration of III–V Nanocrystals into Silicon
212
4.4.3 Nanowires
224
References
234
5 Beyond Semiconductors
249
5.1 Dielectric Thin Films
249
5.1.1 High-k Materials
249
5.1.2 Rare Earth Doping of SiO2
251
5.2 Photovoltaic Applications
253
5.2.1 Mono- and Polycrystalline Solar Cells
254
5.2.2 Thin Film Solar Cells
258
5.3 Transparent Conducting Oxides
260
5.3.1 Zinc Oxide
260
5.3.2 Titanium Oxide
263
5.3.3 Indium Tin Oxide
264
5.3.4 Other TCOs and Beyond
266
5.4 Metallic Films
267
5.4.1 Annealing of Thin Metal Films
268
5.4.2 Material Property Engineering
269
5.4.3 Silicides
269
5.4.4 Printed Electronics
271
5.4.5 Further Applications
272
5.5 Flexible Substrates
273
5.5.1 State of the Art
274
5.5.2 Ink-Environment Interaction
285
5.5.3 Ink-Substrate Interaction
287
References
289
Index
299
Shop