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Flash Lamp Annealing - From Basics to Applications

Flash Lamp Annealing - From Basics to Applications

Lars Rebohle, Slawomir Prucnal, Denise Reichel

 

Verlag Springer-Verlag, 2019

ISBN 9783030232993 , 304 Seiten

Format PDF, OL

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Flash Lamp Annealing - From Basics to Applications


 

Preface

6

Acknowledgements

7

References

8

Contents

9

Acronyms

12

Symbols

14

1 Introduction

18

1.1 Historical Remarks

19

1.2 The Thermal Cycle

24

1.3 Short Time Annealing

26

References

28

2 The Technology of Flash Lamp Annealing

32

2.1 Basic Structure of an FLA Tool

32

2.2 Components of a Flash Lamp

36

2.2.1 Dimensions and Gas Filling

37

2.2.2 Electrodes

38

2.2.3 The Envelope

40

2.2.4 Cooling

42

2.3 Plasma Discharge

43

2.3.1 Trigger Pulse and Initial Streamer Formation

43

2.3.2 Arc Expansion

46

2.3.3 Plasma Properties in the Wall-Stabilized Regime

48

2.3.4 The Post-discharge Period

54

2.4 Electric Operation

55

2.4.1 Electric Characteristics of a Flash Lamp

55

2.4.2 Circuitries

56

2.4.3 Modelling of a Single RLC Section Circuit

59

2.4.4 Active Pulse Shaping

62

2.5 Optical Output

64

2.5.1 The Plasma Spectrum

64

2.5.2 Transparency and Radiation Pattern

66

2.5.3 Time-Resolved Optical Properties

68

2.5.4 Shaping the Spectral Output

68

2.6 Flash Lamp Lifetime

72

2.6.1 Single and Multiple Flash Operation

72

2.6.2 Lamp Failure

73

2.6.3 Lamp Degradation

77

2.7 Layout of FLA Tools

79

2.7.1 From Sheet-to-Sheet to Roll-to-Roll Processes

79

2.7.2 Flash-Assisted Deposition

81

References

84

3 Process Management

88

3.1 Temperature Measurement

88

3.1.1 Pyrometry

89

3.1.2 Temperature Measurement of Semiconductors

91

3.1.3 Temperature Measurement During Annealing of Non-semiconductors

101

3.1.4 True Temperature Measurement

103

3.2 Temperature Simulations

106

3.2.1 Mathematical Background

106

3.2.2 Chamber Wall Reflection

111

3.2.3 Temperature Profiles

115

3.2.4 Heat Dissipation

121

3.3 Homogeneity

123

3.3.1 The Homogeneity of Irradiation

123

3.3.2 Pattern Effects

128

3.4 Thermal Stress

131

3.4.1 Silicon

131

3.4.2 Glassy Substrates and Thin Films

136

3.5 Further Effects

138

References

142

4 Semiconductor Applications

147

4.1 Defect Engineering

147

4.1.1 Defect Evolution During Annealing

147

4.1.2 Boron Diffusion in Si

149

4.1.3 Studies Related to Flash Lamp Annealing

151

4.2 Doping

152

4.2.1 Ultra-Shallow Junctions in Silicon

152

4.2.2 Hyperdoping in Silicon

160

4.2.3 Doping and Superconductivity in Germanium

167

4.2.4 Doping of Silicon Carbide

179

4.2.5 Doping of III–V Compound Semiconductors

184

4.2.6 Diluted Magnetic Semiconductors

190

4.3 Crystallization

194

4.3.1 Non-equilibrium Crystallization Modes

194

4.3.2 Thin Films of Amorphous Silicon

202

4.3.3 Silicon Compound Semiconductors

206

4.4 Semiconductor Nanostructures

210

4.4.1 Group IV Nanocluster

210

4.4.2 Integration of III–V Nanocrystals into Silicon

212

4.4.3 Nanowires

224

References

234

5 Beyond Semiconductors

249

5.1 Dielectric Thin Films

249

5.1.1 High-k Materials

249

5.1.2 Rare Earth Doping of SiO2

251

5.2 Photovoltaic Applications

253

5.2.1 Mono- and Polycrystalline Solar Cells

254

5.2.2 Thin Film Solar Cells

258

5.3 Transparent Conducting Oxides

260

5.3.1 Zinc Oxide

260

5.3.2 Titanium Oxide

263

5.3.3 Indium Tin Oxide

264

5.3.4 Other TCOs and Beyond

266

5.4 Metallic Films

267

5.4.1 Annealing of Thin Metal Films

268

5.4.2 Material Property Engineering

269

5.4.3 Silicides

269

5.4.4 Printed Electronics

271

5.4.5 Further Applications

272

5.5 Flexible Substrates

273

5.5.1 State of the Art

274

5.5.2 Ink-Environment Interaction

285

5.5.3 Ink-Substrate Interaction

287

References

289

Index

299